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Foto Cooler Master Hyper 212X




Cooler Master Hyper 212X

Disipador CPU por aire, heatpipe direct contact, venti 120mm, compatibilidad multisocket AMX/FMX/LGA775/115X/1366/2011

Sin Stock OutOfStock
26.00 (21.49+IVA)


MPN: RR-212X-17PK-R1


EAN/GTIN-13: 4719512050125

Fabricante: Cooler Master

Garantía: 3 años



Pulsa para detalles en web del fabricante



The CoolerMaster Hyper 212X introduces several new features to the incredibly popular 212 series. It uses the same Patented Quad CDC Heatpipe array but features a completely new cooling fan and an improved fin-blade layout. Thanks to the new Smart Engine and 4th Generation Bearing, the MTBF has been pushed up to an incredible 160,000 hours while reducing bearing noise. The redesigned Fan-Blades and Aluminum Fin-Blades have both been optimized to create micro vortices that boost the airflow and circulate it around the heatpipes.

 

  • High performance Copper heatpipes with a fusion bonded copper powder wick.
  • Patented CDC™ technology – 4 direct touch heatpipes creating a gap-less contact surface
  • Aluminum Fin Array with New Tunnel Effect layout for improved heat dissipation.
  • 4th Generation Bearing – MTBF of 160,000 hours thanks to highly durable POM components.
  • Redesigned Fan-blades that create vortices to boost airflow without creating more noise.
  • Smart Fan engine – stops the fan when blocked to prevent damage, and automatically restarts the fan when it has been cleared.
  • Universal mounting system for all Intel and AMD platforms.

 

Each fin-blade of the Hyper 212X features 4 X-shaped vents surrounding a Heatpipe. Oriented in a 45 degree angle to the airflow these vents create areas of higher and lower air pressure which results in several controlled vorteces. The relatively strong gusts of these tiny random and chaotic turbulences reduces overall airflow but improves airflow where it matters – next to the heatpipes.

Funnel shaped aluminum fins and a series of perforated dimples guide the airflow towards the heatpipes. Here special X-Vents, that act similar to tiny airplane wings and prevent deadspots behind and between heatpipes. The combination of both of these patent pending technologies results in notably higher airflow over the heatpipes and the adjacent fin area, which ultimately reduces CPU temperatures.

The POM bearing coating with Polyoxymethylene material which usually used in precision parts requiring high stiffness and low friction does not need to replace lubricant and it also provides consistently lower friction levels than the traditional bearings. Thanks to all these advantages (Self-lubricating, lower friction, and dustproof), the MTBF has been pushed up to an incredible 160,000 hours.

 

Model RR-212X-20PM-R1
CPU Socket Intel LGA 2011/1366/1156/1155/1151/1150/775
AMD FM2/FM1/AM3+/AM3/AM2+/AM2
Dimension 120 x 79 x 158 mm / 4.7 x 3.1 x 6.2 inch
Heat Sink Dimensions 116 x 51 x 158 mm / 4.6 x 2.0 x 6.2 inch
Heat Sink Material 4 Direct contact heatpipes / Aluminum fins
Heat Sink Weight 492g / 1.1lb
Heat Pipes Dimensions ø6mm
Fan Dimension 120 x 120 x 25 mm / 4.7 x 4.7 x 1 inch
Fan Speed 600 - 2,000 RPM (PWM) ± 10%
Fan Airflow 24.9 - 82.9 CFM ± 10%
Fan Air Pressure 0. 3 - 2.09 mm H2O ± 10%
Fan Life Expectancy 160,000 hours
Fan Noise Level (dB-A) 9 - 36 dBA
Bearing Type 4th Generation Bearing
Connector 4-Pin
Fan Rated Voltage 12 VDC
Fan Rated Current 0.37A
Power Consumption 4.44W (max)
Fan Weight 106g / 0.2lb

 

 

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